Inspection device for adhesive break detection "MODEL 274Q"
Newly developed electric field scanning method to reliably capture changes caused by electric field glue.
274Q inspects the adhesive used in packaging immediately after application, detecting reductions in adhesive quantity and adhesive skipping, thereby preventing the shipment of defective products. Its unique electric field scanning method completely overcomes the shortcomings of conventional methods.
- Company：テクノス
- Price：Other
